루비콘에 대하여
RoHS규제물질에 대한 대응
Conforming to RoHS Directive
| TYPE | Aluminum Electrolytic Capacitors | Conductive Polymer Aluminum Solid Electrolytic Capacitors (PC-CON) | |||
|---|---|---|---|---|---|
| SMD Type | Lead Wire Type | Snap-in type | Screw terminal type | SMD Type | |
| RoHS Compliance | Complied | ||||
| Lead | Not contain | ||||
| Cadmium | Not contain | ||||
| Mercury | Not contain | ||||
| Chrome(VI) | Not contain(*1) | ||||
| PBB | Not contain | ||||
| PBDE | Not contain | ||||
| Identification for RoHS Compliance parts | Add "RoHS Compliance" marking on inner and outer carton label | ||||
*1:Band of Screw terminal type: Chromium(Ⅲ)
| TYPE | Film Capacitors | Polymer Multi-Layer Capacitors (PMLCAP®) | Electric Double Layer Capacitors | ||
|---|---|---|---|---|---|
| Metallized Type | Foil type | SMD Type | Lead Wire Snap-in type Type | Screw terminal type | |
| RoHS Compliance | Complied | ||||
| Lead | Not contain | ||||
| Cadmium | Not contain | ||||
| Mercury | Not contain | ||||
| Chrome(VI) | Not contain(*1) | ||||
| PBB | Not contain | ||||
| PBDE | Not contain | ||||
| Identification for RoHS Compliance parts | Add "RoHS Compliance" marking on inner and outer carton label | ||||
*1:Band of Screw terminal type: Chromium(Ⅲ)
Terminal material, Soldering
| TYPE | Aluminum Electrolytic Capacitors | Conductive Polymer Aluminum Solid Electrolytic Capacitors (PC-CON) | |||
|---|---|---|---|---|---|
| SMD Type | Lead Wire Type | Snap-in type | Screw terminal type | SMD Type | |
| Terminal material | (∼Φ10) Fe/Cu/Sn-0.5Bi |
Fe/Cu/Sn | Aluminum | Ni/Pd/Au plating | |
| (Φ12.5∼) Fe/Cu/Sn |
|||||
| Resistance to soldering heat | Please find "Reflow Soldering Condition" | 260ºC Flow Soldering | Not applicable | 260ºC Reflow | |
| TYPE | Film Capacitors | Polymer Multi-Layer Capacitors (PMLCAP®) | Electric Double Layer Capacitors | ||
|---|---|---|---|---|---|
| Metallized Type | Foil type | SMD Type | Lead Wire Snap-in type Type | Screw terminal type | |
| Terminal material | Fe/Cu/Sn or Cu/Sn | Fe/Cu/Sn | Sn plating | Fe/Cu/Sn | Aluminum |
| Resistance to soldering heat | Please find "Soldering Operation" | 260ºC Reflow | 260ºC Flow Soldering | Not applicable | |
Regarding compliance to European REACH Regulation
According to the content of RIP3.8TGD (Technical Guidance Document) which is published on 26 May 2008, our electronic components are "articles without any intended release". Therefore they are not applicable for "Registration" for European REACH Regulation Article 7 (1).
1938-1, Nishi-Minowa Ina City, Nagano 399-4593 Japan TEL:0265-72-7111 FAX:0265-73-2914