对应环境负荷物质
对RoHS指令限制物质的应对措施
| TYPE | Aluminum Electrolytic Capacitors | Film Capacitors | |||
|---|---|---|---|---|---|
| Chip | Radial Lead | Snap-in | Metallized | Foil | |
| RoHS Compliance | Complied | ||||
| Lead | Not contain | ||||
| Terminal material | (∼Φ10) Fe/Cu/Sn-0.5Bi |
Fe/Cu/Sn | Fe/Cu/Sn or Cu/Sn |
Fe/Cu/Sn | |
| (Φ12.5∼) Fe/Cu/Sn |
|||||
| Resistance to Soldering heat | Reflow(*1) | 260℃ Flow Soldering | Please find “Soldering Operation” | ||
| Cadmium | Not contain | ||||
| Mercury | Not contain | ||||
| Chrome(VI) | Not contain | ||||
| PBB/PBDE | Not contain | ||||
| DEHP/BBP/DBP/DIBP | Not contain | ||||
| Identification for RoHS Compliance Parts | Add “RoHS Compliance” marking on inner and outer carton lable | ||||
*1:Please find “Reflow Soldering Condition”.
| TYPE | Conductive Polymer Aluminum Solid Electrolytic Capacitors | Polymer Multi-Layer Capacitors | ||
|---|---|---|---|---|
| Chip | Radial Lead | Chip | Box Type | |
| RoHS Compliance | Complied | |||
| Lead | Not contain | |||
| Terminal material | Fe/Cu/Sn-0.5Bi or Fe/Cu/Sn |
Fe/Cu/Sn | Brass/Cu/Sn | Cu/Sn |
| Resistance to Soldering heat | Reflow(*1) | Flow Soldering 260℃ |
260℃ Reflow/Flow Soldering |
Flow Soldering 260℃ |
| Cadmium | Not contain | |||
| Mercury | Not contain | |||
| Chrome(VI) | Not contain | |||
| PBB/PBDE | Not contain | |||
| DEHP/BBP/DBP/DIBP | Not contain | |||
| Identification for RoHS Compliance Parts | Add “RoHS Compliance” marking on inner and outer carton label | |||
*1:Please find “Reflow Soldering Condition”.
遵守欧洲REACH法规
根据RIP 3.8TGD（技术指导文件：2008年5月26日发布）的内容，我们的电子元件属于 “无故意释放的物品”，不属于欧洲REACH法规第7.1条 “注册 “的范围。