Compliance to Environmentally Hazardous Substances
Conformance with RoHS Directives
| TYPE | Aluminum Electrolytic Capacitors | Film Capacitors | ||||
|---|---|---|---|---|---|---|
| Chip | Radial Lead | Snap-in | Screw terminal | Metallized | Foil | |
| RoHS Compliance | Complied | |||||
| Lead | Not contain | |||||
| Terminal material | (∼Φ10) Fe/Cu/Sn-0.5Bi |
Fe/Cu/Sn | Aluminum | Fe/Cu/Sn or Cu/Sn |
Fe/Cu/Sn | |
| (Φ12.5∼) Fe/Cu/Sn |
||||||
| Resistance to Soldering heat | Reflow(*2) | 260℃ Flow Soldering | Not applicable | Please find “Soldering Operation” | ||
| Cadmium | Not contain | |||||
| Mercury | Not contain | |||||
| Chrome(VI) | Not contain(*1) | |||||
| PBB/PBDE | Not contain | |||||
| DEHP/BBP/DBP/DIBP | Not contain | |||||
| Identification for RoHS Compliance Parts | Add “RoHS Compliance” marking on inner and outer carton lable | |||||
*1:Band of Screw terminal type: Chromium(III)
*2:Please find “Reflow Soldering Condition”.
| TYPE | Conductive Polymer Aluminum Solid Electrolytic Capacitors | Polymer Multi-Layer Capacitors | Electric Double Layer Capacitors | |||
|---|---|---|---|---|---|---|
| PZ-CAP | Chip | Radial Lead | Radial Lead | |||
| RoHS Compliance | Complied | |||||
| Lead | Not contain | |||||
| Terminal material | Lead | Fe/Cu/Sn | Brass/Cu/Sn | Fe/Cu/Sn | Fe/Cu/Sn | |
| Chip | Fe/Cu/Sn-0.5Bi | |||||
| Resistance to Soldering heat | Lead | Flow Soldering 260℃ |
260℃ Reflow/Flow Soldering |
Flow Soldering 260℃ |
Flow Soldering 260℃ |
|
| Chip | Reflow(*2) | |||||
| Cadmium | Not contain | |||||
| Mercury | Not contain | |||||
| Chrome(VI) | Not contain(*1) | |||||
| PBB/PBDE | Not contain | |||||
| DEHP/BBP/DBP/DIBP | Not contain | |||||
| Identification for RoHS Compliance Parts | Add “RoHS Compliance” marking on inner and outer carton label | |||||
*1:Band of Screw terminal type: Chromium(III)
*2:Please find “Reflow Soldering Condition”.
Regarding compliance to European REACH Regulation
According to the content of RIP3.8TGD (Technical Guidance Document) which is published on 26 May 2008, our electronic components are “articles without any intended release”. Therefore they are not applicable for “Registration” for European REACH Regulation Article 7 (1).