Compliance to Environmentally Hazardous Substances
Conformance with RoHS Directives
| TYPE | Aluminum Electrolytic Capacitors | Film Capacitors | |||
|---|---|---|---|---|---|
| Chip | Radial Lead | Snap-in | Metallized | Foil | |
| RoHS Compliance | Complied | ||||
| Lead | Not contain | ||||
| Terminal material | (∼Φ10) Fe/Cu/Sn-0.5Bi |
Fe/Cu/Sn | Fe/Cu/Sn or Cu/Sn |
Fe/Cu/Sn | |
| (Φ12.5∼) Fe/Cu/Sn |
|||||
| Resistance to Soldering heat | Reflow(*1) | 260℃ Flow Soldering | Please find “Soldering Operation” | ||
| Cadmium | Not contain | ||||
| Mercury | Not contain | ||||
| Chrome(VI) | Not contain | ||||
| PBB/PBDE | Not contain | ||||
| DEHP/BBP/DBP/DIBP | Not contain | ||||
| Identification for RoHS Compliance Parts | Add “RoHS Compliance” marking on inner and outer carton lable | ||||
*1:Please find “Reflow Soldering Condition”.
| TYPE | Conductive Polymer Aluminum Solid Electrolytic Capacitors | Polymer Multi-Layer Capacitors | ||
|---|---|---|---|---|
| Chip | Radial Lead | Chip | Box Type | |
| RoHS Compliance | Complied | |||
| Lead | Not contain | |||
| Terminal material | Fe/Cu/Sn-0.5Bi or Fe/Cu/Sn |
Fe/Cu/Sn | Brass/Cu/Sn | Cu/Sn |
| Resistance to Soldering heat | Reflow(*1) | Flow Soldering 260℃ |
260℃ Reflow/Flow Soldering |
Flow Soldering 260℃ |
| Cadmium | Not contain | |||
| Mercury | Not contain | |||
| Chrome(VI) | Not contain | |||
| PBB/PBDE | Not contain | |||
| DEHP/BBP/DBP/DIBP | Not contain | |||
| Identification for RoHS Compliance Parts | Add “RoHS Compliance” marking on inner and outer carton label | |||
*1:Please find “Reflow Soldering Condition”.
Regarding compliance to European REACH Regulation
According to the content of RIP3.8TGD (Technical Guidance Document) which is published on 26 May 2008, our electronic components are “articles without any intended release”. Therefore they are not applicable for “Registration” for European REACH Regulation Article 7 (1).